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        sell 3,4-Epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate

        3,4-Epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate have good fluidity, less or no organic solvent during processing, soluble in various organic solvents such as acetone, ethanol, benzene, etc.Saturated structure, excellent weather resistance, no cracking or yellowing of the finished product, carbon dioxide and water during electrical decomposition, and no short circuit caused by graphite produced by aromatic resin.Low chlorine content, especially suitable for insulating materials with high electrical performance requirements, high temperature insulation, arc resistance and strong trace resistance. It can be cured by heat or light, and it can be cured quickly. The curing shrinkage rate is low, and the cured product has a high crosslink density. The thermal stability is good, and the heat resistance temperature of Martin can reach above 200 °C. It can be used for a long time under the high temperature of 200-250 °C. It also has excellent UV and radiation resistance. Has good water resistance and alkali resistance.

        3,4-Epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate

        Synonyms:7-Oxabicyclo[4.1.0]hept-3-ylmethyl 7-oxabicyclo[4.1.0]heptane-3-carboxylate

        Molecular Formula:C14H20O4

        Molecular Weight:252.31

        CAS:2386-87-0

        EINECS:219-207-4

        Density:1.17

        Melting point:-37 oC

        Refractive index:1.498

        Flash point:245 oF

        Purity:98%

        3,4-Epoxycyclohexylmethyl 3,4-epoxycyclohexanecarboxylate have good fluidity, less or no organic solvent during processing, soluble in various organic solvents such as acetone, ethanol, benzene, etc.Saturated structure, excellent weather resistance, no cracking or yellowing of the finished product, carbon dioxide and water during electrical decomposition, and no short circuit caused by graphite produced by aromatic resin.Low chlorine content, especially suitable for insulating materials with high electrical performance requirements, high temperature insulation, arc resistance and strong trace resistance. It can be cured by heat or light, and it can be cured quickly. The curing shrinkage rate is low, and the cured product has a high crosslink density. The thermal stability is good, and the heat resistance temperature of Martin can reach above 200 °C. It can be used for a long time under the high temperature of 200-250 °C. It also has excellent UV and radiation resistance. Has good water resistance and alkali resistance.


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